Thermal evaluation of an integrated circuit chip using infrared imaging and finite element techniques

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Title: Thermal evaluation of an integrated circuit chip using infrared imaging and finite element techniques
Author: Lerch, Terence
Abstract: Thermal Analysis of a prototype IC chip was performed with the use of an Agema Infrared Thermal Imaging System and the Algor Thermal Supersap Heat Transfer finite elements software package. A preliminary calibration of the Agema Thermal Imaging system demonstrated its accuracy to be within ± 0.5 °C of the actual surface temperature being measured. Computed emissivities were within 6.0% of actual emissivity values of a surface. Qualitative comparison of the IC chip's temperature profiles measured by the Agema system and computed by the Algor finite elements package revealed agreement between the two techniques. Quantitative comparison between the two resulted in temperature values that did not correspond well because of simplifying assumptions made when implementing the Algor finite elements package.
Record URI: http://hdl.handle.net/1850/11113
Date: 1991-07

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