Topography and wettability control in biocompatible polymer for bioMEMS applications

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dc.contributor.author Teh, Kwok
dc.contributor.author Lu, Yen-Wen
dc.date.accessioned 2010-02-03T19:38:31Z
dc.date.available 2010-02-03T19:38:31Z
dc.date.issued 2008-01
dc.identifier.citation Proceedings of the 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Sanya, China, January 6-9, 2008 en_US
dc.identifier.uri http://hdl.handle.net/1850/11347
dc.description.abstract This paper elucidates the extent of changes in surface wettability as influenced by the surface topography on a conducting polymer, polypyrrole. As-deposited, anion-doped polypyrrole is subjected to a series of incremental redox potentials ranging from -0.6V to +1.5V (vs. Ag/AgCl), and its surface properties are examined via SEM, AFM, and contact angle measurements. A causal relationship is found to exist between the oxidation states of polypyrrole and its surface topography. At redox potential lower than +0.6V, the polymer is completely hydrophilic (contact angle <90°) as ascribed partially to its smooth surface. It becomes less hydrophilic in the range of +0.6—+1.0V and turns totally hydrophobic beyond +1.0V. Such a change in surface wettability is attributed in part to the increased surface roughness, as measured by AFM. As redox potentials increase from -0.6V to +1.5V, the corresponding average surface roughness rises from 3.1nm to 31.1nm – a 10-fold increase. Visual inspection by SEM indicates the formation of islets on the polymer during the oxidation process. Based on our experimental results, we hypothesize that as redox potential increases, changes of surface topography decrease the surface wettability of polypyrrole. en_US
dc.language.iso en_US en_US
dc.publisher IEEE en_US
dc.subject BioMEMS en_US
dc.subject Hydrophobic en_US
dc.subject Nanostructured en_US
dc.subject Polypyrrole en_US
dc.subject Topography en_US
dc.subject Wettability en_US
dc.title Topography and wettability control in biocompatible polymer for bioMEMS applications en_US
dc.type Proceedings en_US

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