Automatic visual inspection of placement of bare dies in multichip modules

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Title: Automatic visual inspection of placement of bare dies in multichip modules
Author: Chheda, Mahesh
Abstract: Multichip Modules are gaining lot of popularity in today's IC technology, as they are good solutions for high density packaging. This thesis presents a method for checking the placement of bare dies on a common substrate of an MCM. This testing is done using Automatic Visual Inspection (AVI), which is better and more reliable, compared to manual inspection. Comparison is the basis in this thesis to detect faults in an MCM. The MCM to be tested is compared with a known good ideal MCM using image processing techniques. The mismatches, if any, between these two images, i.e. image of an MCM which is being tested and image of known good reference MCM, are evaluated to find the exact location and nature of the fault. This AVI is implemented completely in software using C language. Test cases and their results are presented.
Record URI: http://hdl.handle.net/1850/11704
Date: 1994-10

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