Heat transfer in DIRSIG an infrared synthetic scene generation model

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dc.contributor.advisor Schott, John
dc.contributor.advisor Salvaggio, Carl
dc.contributor.advisor Mulay, Shirish
dc.contributor.author Sirianni, Joseph
dc.date.accessioned 2010-03-22T14:09:52Z
dc.date.available 2010-03-22T14:09:52Z
dc.date.issued 1994-07
dc.identifier.uri http://hdl.handle.net/1850/11734
dc.description.abstract Improvements to the thermodynamic model in the RIT Digital Imaging and Remote Sensing Lab's synthetic image generation software model, DIRSIG, were made to account for three forms of heat transfer: conduction, convection, and radiation from an internal heat source. A validation was completed that collected truth data and evaluated the performance of the modifications. The simulated contrast of the final temperature images was relatively close to truth contrast. In addition, the exposed area term from the thermodynamic model was modified with the DIRSIG shape factor calculation for four different scenarios to improve background object temperature interactions. The best scenario was a replacement of the exposed area with the shape factor in the sky/background temperature equation. Finally, interpolation on weather data to decrease discrete shadow edges was performed and evaluated. This approach significandy reduced edge effects, but due to incorrect scene geometry, previous simulated imagery and previous truth imagery did not coincide, making final conclusions difficult to predict. en_US
dc.language.iso en_US en_US
dc.subject Imaging science en_US
dc.subject.lcc TA1570 .S54 1994
dc.subject.lcsh Infrared imaging--Computer simulation en_US
dc.subject.lcsh Infrared technology--Simulation methods en_US
dc.subject.lcsh Remote sensing--Data processing en_US
dc.subject.lcsh Heat--Transmission--Data processing en_US
dc.title Heat transfer in DIRSIG an infrared synthetic scene generation model en_US
dc.type Thesis en_US
dc.description.college College of Science en_US
dc.description.department Chester F. Carlson Center for Imaging Science en_US

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