Evaluation of packaging materials under vacuum for potential use as internal cushioning for semiconductor industry vacuum machinery

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Title: Evaluation of packaging materials under vacuum for potential use as internal cushioning for semiconductor industry vacuum machinery
Author: Baisch, Andrew
Abstract: This study explores a concept for applying basic packaging materials to an environment of high vacuum. This study identified three basic packaging materials and exposed them to a high vacuum environment to identify visual effects caused by the vacuum. In semiconductor and data storage industries, the machinery needed to ultimately create a computer chip often contains vacuum chambers. A common practice of the industry is to ship this machinery while under a state of high vacuum. There are parts inside these vacuum chambers that need protection from the effects of shock and vibration. By placing a sample of packaging material inside a chamber, pumping the chamber to a state of high vacuum, pumping the chamber back down to atmosphere and opening the chamber, a visual inspection of the material can identify that the material itself has failed to maintain its structure. The conclusion of this study identified one material that may warrant further, more precise research and testing for the possibility of use as a cushioning material under vacuum.
Record URI: http://hdl.handle.net/1850/14422
Date: 2000

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