Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

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Title: Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma
Author: Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald
Abstract: Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified surfaces showed the following: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of the surface; and (4) incorporation of oxygen as CF—O—CF2, CF2—O—CF2 and CF—O—CF3 moieties. With long treatment times, a cohesive failure of copper sputter-coated onto the modified surface occurred within the modified FEP and not at the Cu–FEP interface.
Record URI: http://hdl.handle.net/1850/2232
Publishers URL: http://dx.doi.org/10.1163/1568561042323202
Date: 2004-12

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