Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma

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Title: Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma
Author: Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald
Abstract: Good practical adhesion of sputter-deposited Cu is achieved to poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar microwave (MW) plasma. Factors contributing to the adhesion include: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of the surface; (4) cross-linking at the surface and (5) incorporation of oxygen as CF-O-CF2, CF2-O-CF2 and CF-O-CnF2n+1 moieties. With long treatment times, a cohesive failure occurred within the modified PFA and not at the Cu-PFA interface due to extensive chain scission weakening its mechanical properties.
Description: Archived at: http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=2723&DID=95820
Record URI: http://hdl.handle.net/1850/2233
Date: 2005

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