Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

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Title: Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma
Author: Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald
Abstract: Fluoropolymers, like Teflon(r) PTFE (polytetrafluoroethylene) and FEP (fluorinated ethylene-propylene co-polymer), have been extensively used in space applications, protective coatings, microelectronics packaging and biotechnology. However, their low surface energy properties present considerable challenges for adhesion and wettability when bonding to other materials, such as the conductor copper. Therefore, processes, that provide surface modification of these materials, are of considerable interest. Recently, the adhesion of copper was enhanced with treatment of PTFE surfaces downstream from two sources of vacuum UV (VUV) radiation: (1) a unique high-pressure windowless helium excimer lamp having a continuum from 58-110 nm and (2) a windowless low-pressure microwave (MW) discharge of He or Ar which is primarily a VUV line source due to emission from excited rare gas atoms. In the present study, the adhesion of Cu was investigated on FEP surfaces that were modified with VUV radiation downstream from a low-pressure Ar MW plasma. Neutral Ar resonance lines, arising from 3P1_ 1So and 3P2- 1So transitions, occur at 104.8 and 106.7 nm, respectively. During most of the experiments, oxygen was flowed over the VUV-exposed substrates.
Description: Article may be found at: http://membership.acs.org/P/PMSE/
Record URI: http://hdl.handle.net/1850/2240
Date: 2004

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