Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

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dc.contributor.author Dasilva, W. en_US
dc.contributor.author Entenberg, Alan en_US
dc.contributor.author Kahn, B. en_US
dc.contributor.author Debies, Thomas en_US
dc.contributor.author Takacs, Gerald en_US
dc.date.accessioned 2006-07-19T20:02:29Z en_US
dc.date.available 2006-07-19T20:02:29Z en_US
dc.date.issued 2004 en_US
dc.identifier.citation Polymeric Materials Science and Engineering 90 (2004) en_US
dc.identifier.issn 0743-0515 en_US
dc.identifier.uri http://hdl.handle.net/1850/2240 en_US
dc.description Article may be found at: http://membership.acs.org/P/PMSE/ en_US
dc.description.abstract Fluoropolymers, like Teflon(r) PTFE (polytetrafluoroethylene) and FEP (fluorinated ethylene-propylene co-polymer), have been extensively used in space applications, protective coatings, microelectronics packaging and biotechnology. However, their low surface energy properties present considerable challenges for adhesion and wettability when bonding to other materials, such as the conductor copper. Therefore, processes, that provide surface modification of these materials, are of considerable interest. Recently, the adhesion of copper was enhanced with treatment of PTFE surfaces downstream from two sources of vacuum UV (VUV) radiation: (1) a unique high-pressure windowless helium excimer lamp having a continuum from 58-110 nm and (2) a windowless low-pressure microwave (MW) discharge of He or Ar which is primarily a VUV line source due to emission from excited rare gas atoms. In the present study, the adhesion of Cu was investigated on FEP surfaces that were modified with VUV radiation downstream from a low-pressure Ar MW plasma. Neutral Ar resonance lines, arising from 3P1_ 1So and 3P2- 1So transitions, occur at 104.8 and 106.7 nm, respectively. During most of the experiments, oxygen was flowed over the VUV-exposed substrates. en_US
dc.format.extent 31371 bytes en_US
dc.format.mimetype application/pdf en_US
dc.language.iso en_US en_US
dc.publisher The American Chemical Society: Polymeric Materials Science and Engineering en_US
dc.title Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma en_US
dc.type Abstract en_US
dc.subject.keyword Adhesion en_US
dc.subject.keyword Copper en_US
dc.subject.keyword Photo-oxidation en_US
dc.subject.keyword Teflon en_US

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