Fouling in silicon microchannel designs used for IC chip cooling and its mitigation

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dc.contributor.advisor Kurinec, Santosh K.
dc.contributor.advisor Jackson, Michael
dc.contributor.advisor Moon, James
dc.contributor.author Perry, Jeffrey L.
dc.date.accessioned 2008-05-22T20:40:53Z
dc.date.available 2008-05-22T20:40:53Z
dc.date.issued 2007-10
dc.identifier.uri http://hdl.handle.net/1850/6211
dc.description.abstract Particulate fouling studies with alumina and silica dispersions were performed in silicon, rectangular microchannels having hydraulic diameters between 220-225 μm. The particulates used ranged from the colloidal size range up to tens of microns in size (for particle aggregates). Data show for the most part the absence of particle depositions within the microchannels. This is even the case when there is an electrostatic attraction between the particles and the microchannel surface. The primary reason for this is due to the high wall shear stress at the microchannel walls. In contrast, the headers for the microchannels are quite susceptible to particulate fouling under the same conditions. This is because the shear stress at the surface is lower. This fouling within the header, however, does not provide an increase in pressure drop within the microchannel device. Moreover, depositions within the header region can be mitigated with proper pH adjustment. There is a secondary effect in particulate fouling when fibrous elements exist within the particle dispersion. The fouling behavior due to fibrous material is quite different. In fact, the presence of fibers is extremely detrimental to pressure drops within a microchannel device. A multi-scale force balance model for particulate fouling is developed. It uses conventional theories on the forces between a particle and a wall which are extended to particulate fouling within a microchannel device. The model covers a scale spanning several orders of magnitude. In addition, it includes van der Waals forces, electrostatic forces, fluidmechanics- related forces due to shear/lift, and a body force due to gravity. en_US
dc.language.iso en_US en_US
dc.subject Fluidmechanics en_US
dc.subject Microchannels en_US
dc.subject Particulate fouling studies en_US
dc.subject Van der Waals Force en_US
dc.subject.lcc TJ263 .P47 2008
dc.subject.lcsh Heat exchangers--Fouling en_US
dc.subject.lcsh Heat exchangers--Fluid dynamics en_US
dc.subject.lcsh Fluid-structure interaction en_US
dc.subject.lcsh Integrated circuits--Cooling en_US
dc.subject.lcsh Heat sinks (Electronics) en_US
dc.title Fouling in silicon microchannel designs used for IC chip cooling and its mitigation en_US
dc.type Dissertation en_US
dc.description.college Kate Gleason College of Engineering en_US
dc.description.department Department of Microsystems Engineering en_US
dc.contributor.advisorChair Kandlikar, Satish

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