Adhesion of copper to UV photo-oxidized polyimide (PMDA-ODA) surfaces

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Title: Adhesion of copper to UV photo-oxidized polyimide (PMDA-ODA) surfaces
Author: Sener, U.; Entenberg, Alan; Kahn, Bruce; Egitto, F.; Matienzo, L.; Debies, Thomas
Abstract: Polyimide (PI), Kapton HN500 (PMDA-ODA), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a little change in surface morphology following treatment. XPS showed an approximate doubling of the atomic O concentration on the modified surface which appeared mostly as the carbonyl moiety. Copper was sputter coated onto the modified PI surface. With long treatment times, cohesive failure occurred within the modified PI and not at the Cu-PI interface. Following cohesive failure, XPS and TOF-SIMS indicated a very thin (<= 10 nm) weak boundary layer of PI adhering to the Cu. The weak boundary layer was removed with a hexane wash.
Description: 3rd International Symposium on Polyimides and Other High Temperature Polymets Orlando, FL, DEC 17, 2003RIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/
Record URI: http://hdl.handle.net/1850/7294
Date: 2005-06-30

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