Adhesion of copper to UV photo-oxidized polyimide (PMDA-ODA) surfaces

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dc.contributor.author Sener, U.
dc.contributor.author Entenberg, Alan
dc.contributor.author Kahn, Bruce
dc.contributor.author Egitto, F.
dc.contributor.author Matienzo, L.
dc.contributor.author Debies, Thomas
dc.date.accessioned 2008-10-27T16:36:39Z
dc.date.available 2008-10-27T16:36:39Z
dc.date.issued 2005-06-30
dc.identifier.citation Polyimides And Other High Temperature Polymers: Synthesis, Characterization and Applications 3 (2005) 535-552 en_US
dc.identifier.isbn 90-6764-422-6
dc.identifier.uri http://hdl.handle.net/1850/7294
dc.description 3rd International Symposium on Polyimides and Other High Temperature Polymets Orlando, FL, DEC 17, 2003 en_US
dc.description RIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/
dc.description.abstract Polyimide (PI), Kapton HN500 (PMDA-ODA), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a little change in surface morphology following treatment. XPS showed an approximate doubling of the atomic O concentration on the modified surface which appeared mostly as the carbonyl moiety. Copper was sputter coated onto the modified PI surface. With long treatment times, cohesive failure occurred within the modified PI and not at the Cu-PI interface. Following cohesive failure, XPS and TOF-SIMS indicated a very thin (<= 10 nm) weak boundary layer of PI adhering to the Cu. The weak boundary layer was removed with a hexane wash. en_US
dc.language.iso en_US en_US
dc.publisher Brill Academic Publishers: Polyimides And Other High Temperature Polymers: Synthesis, Characterization and Applications en_US
dc.relation.ispartofseries vol. 3 en_US
dc.relation.ispartofseries pps. 535-552 en_US
dc.subject Organic polymer surfaces en_US
dc.subject Plasma modification en_US
dc.subject Excimer laser en_US
dc.subject Metallization en_US
dc.subject Radiation en_US
dc.subject Films en_US
dc.subject Oxygen en_US
dc.subject Environment en_US
dc.subject Interface en_US
dc.subject Resonance en_US
dc.title Adhesion of copper to UV photo-oxidized polyimide (PMDA-ODA) surfaces en_US
dc.type Proceedings en_US

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