Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge

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dc.contributor.author JB, MA
dc.contributor.author VanDerveer, William
dc.contributor.author Entenberg, Alan
dc.contributor.author Lindberg, Vern
dc.contributor.author Anschel, M.
dc.contributor.author Shih, Dy
dc.contributor.author Lauro, P.
dc.date.accessioned 2008-11-19T16:24:30Z
dc.date.available 2008-11-19T16:24:30Z
dc.date.issued 1995
dc.identifier.citation Journal of Adhesion Science and Technology 9 (1995) 487-499 en_US
dc.identifier.issn 0169-4243
dc.identifier.issn Online: 1568-5616
dc.identifier.uri http://hdl.handle.net/1850/7548
dc.description.abstract We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 mu m) to flexible polyimide (PI) substrates between 25 and 125 mu m thick. The polyimide types include Kapton (PMDA-ODA) and Upilex (BPDA-PDA). When there was no surface modification on the PI, the adhesion of the film to Upilex type S was better than the adhesion to Upilex type R or Kapton type HN. When the polymer surface was treated with a simple AC nitrogen glow discharge (NGD), there was an improvement in the adhesion of the film to each of these polyimides. This improvement in adhesion became apparent after the film/substrate combination was subjected to either boiling water or steam for 30 min or more; the difference became quite clear after 2 h. A simple tape test was used to quickly estimate a relative adhesion strength. In order to compare the effect of our AC NGD treatment with other substrate surface modification methods, we used it to improve the coupling of a thick (>10 mu m) layer of copper (via a thin intermediate chromium layer) to a rigid PI substrate, formed from spin coating its precursor onto a silicon wafer. Peel test results were within a factor of 2-3 of the corresponding results obtained with a radio frequency (RF) plasma and ion beam treatments. en_US
dc.language.iso en_US en_US
dc.publisher Brill (VSP): Journal of Adhesion Science and Technology en_US
dc.relation.ispartofseries vol. 9 en_US
dc.relation.ispartofseries no. 4 en_US
dc.relation.ispartofseries pps. 487-499 en_US
dc.subject Adhesion en_US
dc.subject Copper en_US
dc.subject Polymide en_US
dc.subject Temperature en_US
dc.subject Humidity en_US
dc.subject Glow Discharge en_US
dc.subject Plasma modification en_US
dc.subject Enhancement en_US
dc.subject Interfaces en_US
dc.title Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge en_US
dc.type Article en_US
dc.identifier.url http://dx.doi.org/10.1163/156856195X00419

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