Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes

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Title: Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
Author: Ramkumar, S. Manian; Kannabiran, Anand; Penmatsa, Sreekanth; Ghaffarian, Reza
Record URI: http://hdl.handle.net/1850/8378
Date: 2007

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