Thermal cycle/aging reliability of lead free 0201 assemblies

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Title: Thermal cycle/aging reliability of lead free 0201 assemblies
Author: Ghaffarian, Reza; Ramkumar, S. Manian; Varanasi, Arun
Abstract: This paper presents the test results and comparative literature data on the influence of a few key manufacturing parameters and defects associated with the 0201 components using lead-free and tin-lead solder alloys. A large number of test vehicles assembled with 0201 components were subjected to isothermal aging at 150°C and thermal cycling in the range of -55° to 100°C in order to establish their reliability. The shear tests were carried out at various aging intervals up to 500 hours to determine the effects of aging damage on the solder joint strength and this data will be presented and compared to virgin assemblies. Weibull plots will be given for reliability to establish solder joint aging behavior for the lead free assemblies compared to lead based solder as well as data correlation for various sets of data. Optical inspection photos taken during thermal cycling to establish damage progress, scanning electron microscopy (SEM) photos to reveal details of damage at 1500 cycles, and cross-sectional photomicrographs showing interconnect microstructural changes and intermetallic formation will also be presented.
Description: ©2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE."Thermal cycle/aging reliability of lead free 0201 assemblies," Proceedings of the 56th Electronic Components & Technology Conference. Held in San Diego, CA: 30 May - 2 June 2006.
Record URI: http://hdl.handle.net/1850/8390
Date: 2006

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