Fluid flow modeling for flip chip on board assembly

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Title: Fluid flow modeling for flip chip on board assembly
Author: Venkatraman, P.; Ramkumar, S. Manian
Description: "Fluid Flow Modeling for Flip Chip on Board Assembly," SMTA Pan Pacific Microelectronics Symposium. Held in Maui, Hawaii: February 2002
Record URI: http://hdl.handle.net/1850/8611
Date: 2002

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