Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions

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Title: Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions
Author: Ramkumar, S. Manian; Srihari, Krishnaswami
Description: "Performance of a Novel Anisotropic Conductive Adhesive under Thermal and Temperature/Humidity Aging Conditions," 39th International Symposium on Microelectronics Packaging, IMAPS 2006. Held in Sand Deigo, California: 8-12 October 2006
Record URI: http://hdl.handle.net/1850/8631
Date: 2006

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