Effect of stencil and PCB parameters on 2001 assembly process defects

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Title: Effect of stencil and PCB parameters on 2001 assembly process defects
Author: Ramkumar, S. Manian; Newasekar, Rahul; Ghaffarian, Reza
Description: "Effect of Stencil and PCB Parameters on 2001 Assembly Process Defects," 37th International Symposium on Microelectronics Packaging, IMAPS 2004. Held in Long Beach, California: 14-18 November 2004
Record URI: http://hdl.handle.net/1850/8636
Date: 2004

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