Effect of stencil and PCB parameters on 2001 assembly process defects

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dc.contributor.author Ramkumar, S. Manian
dc.contributor.author Newasekar, Rahul
dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2009-03-18T17:05:29Z
dc.date.available 2009-03-18T17:05:29Z
dc.date.issued 2004
dc.identifier.uri http://hdl.handle.net/1850/8636
dc.description "Effect of Stencil and PCB Parameters on 2001 Assembly Process Defects," 37th International Symposium on Microelectronics Packaging, IMAPS 2004. Held in Long Beach, California: 14-18 November 2004 en_US
dc.language.iso en_US en_US
dc.publisher 37th International Symposium on Microelectronics Packaging, IMAPS 2004 en_US
dc.title Effect of stencil and PCB parameters on 2001 assembly process defects en_US
dc.type Proceedings en_US

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