Microelectronic engineering education for emerging frontiers

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dc.contributor.author Kurinec, Santosh
dc.contributor.author Ewbank, Dale
dc.contributor.author Fuller, Lynn
dc.contributor.author Hirschman, Karl
dc.contributor.author Jackson, Michael
dc.contributor.author Pearson, Robert
dc.contributor.author Rommel, Sean
dc.contributor.author Smith, Bruce
dc.contributor.author Surendra, Gupta
dc.date.accessioned 2009-06-25T19:47:06Z
dc.date.available 2009-06-25T19:47:06Z
dc.date.issued 2006-07
dc.identifier.uri http://hdl.handle.net/1850/9962
dc.description Conference proceedings of the 9th international conference on engineering education. en_US
dc.description.abstract With the support provided by the National Science Foundation and RIT Provost’s vision for providing flexible curricula, the department of Microelectronic Engineering has instituted new and enhanced program initiatives – (1) offering a semiconductor processing minor for other science and engineering programs promoting access to state-of-the art semiconductor fabrication facilities to students from other programs; (2) crafting a five course elective sequence within the existing curriculum by eliminating legacy material and course consolidation; (3) developing a concentration program in nanotechnology and MEMS; (4) outreach programs for targeting larger and diverse participation in preparing workforce for the nation’s future high tech industry; (5) enhance student learning through co-op and service. The mission is to generate multi faceted work force for the future semiconductor technologies and emerging frontiers spinning off from microelectronics, while simultaneously promoting enrollment particularly from women and minority students. en_US
dc.language.iso en_US en_US
dc.publisher Rochester Institute of Technology en_US
dc.subject Microelectronics curriculum en_US
dc.subject Nanotechnology and MEMs education en_US
dc.subject Semiconductor processing minor en_US
dc.title Microelectronic engineering education for emerging frontiers en_US
dc.type Proceedings en_US

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